INTERNAL DEVELOPMENT STUDY
Modular instrument enclosure
Combine serviceable electronics packaging, interchangeable panels and a defined thermal path.
Project updates & results
Proposed study
This is a proposed internal development study. Verified parts and results are not yet available.
The brief defines what the study will investigate and measure.
The proposed brief
Package a representative sensor or data-logging board so connectors, mounting arrangements and electronics can change without redesigning the whole enclosure. Provide access for maintenance and a defined thermal path.
Design, iteration & manufacture
Printed packaging models and insert trials; a folded or machined aluminium shell; polymer or elastomer seals and supports; standard fasteners; interchangeable connector panels. Compare two or three layouts using a dummy electronics payload or controlled low-voltage heat source.
What the study will measure
Assembly time, access/tool clearance, panel interchangeability, insert durability, temperature rise under a stated heat load and mass. Define any vibration, ingress or EMC testing with a suitable partner; workshop splash observations do not establish an IP rating or defence/rail approval.
Applications for customers
A configurable product platform that is easier to assemble and maintain. Suitable for defence support, onshore/offshore condition monitoring, rail and transport electronics. It provides a visually clear metal/polymer/seal assembly for the website and can house the instrumentation for DS06 or DS12.
Markforged within the proposed route
Partner Markforged printing can support suitable fit models, fixtures or representative polymer/composite parts. We select the printer, base material and compatible reinforcement against the part’s requirements. This available capability does not establish readiness for this study.
Explore partner printers and materials ↗