DPM Technologies Ltd

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INTERNAL DEVELOPMENT STUDY

Electronics cold plate

Compare temperature distribution and pressure loss around a controlled dummy heat source.

Project updates & results

Proposed study

This is a proposed internal development study. Verified parts and results are not yet available.

The brief defines what the study will investigate and measure.

The proposed brief

Remove a defined heat load within a fixed footprint while controlling pressure loss, surface temperature variation and assembly mass. Use controlled dummy heaters rather than an operational battery pack.

Design, iteration & manufacture

Compare a simple baseline channel arrangement with a revised layout; manufacture a suitable aluminium prototype with a joined or sealed cover, or use partner metal additive manufacture where justified. Printed models can demonstrate routing and fit; thermal conclusions require appropriate material-representative hardware.

What the study will measure

Temperature distribution, thermal resistance, flow, pressure loss, leakage, mass and uncertainty at comparable conditions. A higher flow rate should not be presented as a geometry-only improvement. State the joining and inspection route and the pressure/temperature envelope of the test.

Applications for customers

EV and commercial transport electronics, stationary power conversion, motorsport and industrial drives. It extends the thermal-testing capability of the existing heat-exchanger proposal while answering a distinct planar packaging problem. MTC has published cold-plate development for compact electronics. MTC cold-plate example